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FOG/FOB O XCH77-A6

FOG/FOB Bonding M/C


 

Application:

aƷmڸNҺLCD PANELSENSOR GLASSӲ|·壨PCBPCBAcԾ·壨FPCCOFTABFOGFOBˇеğቺ

 

The machine is used for bonding all kinds of FPC, COF, TAB and liquid crystal screen panel (LCD PANEL), SENSOR GLASS, PCB, and PCBA multi stations assembly.

 

Details:

Ӱϵy   High definition visual system

ɶΪؿϵy   Temperature controlling

LEDԴ   LED light controller

XS׶λ   X-axis locating part

X-Y-^{C  Adjusting group of pressure head

X-Y-ZSC   Group of X-Y-Z Moving Axis

ȫűob  Grating protection

FPCƽ̨X-Y-{C  Micrometer adjuster

ob   Anti-static Device

PCBCOFм   PCB, COF bracket

CCDλC    CCD aligning group

 

Introduction:

1 _CλOԭc

2 c˙CMԄģʽ

3 ˹߅ϣX Y λλգƽ̨Panel Xλ½

4 pֆӣPanel ƽ̨dҕXλ̎

4 PCB ƽ̨ϣPCB հIPCB ƽ̨PCB ס Panel ƽ̨ZS½λ

5 ք{PCB ξX-Y- MЌλ

6 pӰoPanel ƽ̨Եλ‰

7 ᣬƽ̨Ƅӵһλλɻصλ˹

 

1. Start and reset machine, the machine go back to origin.

2. Enter auto mode.

3. Put panel onto platform and positioned by locating parts. Turn on vacuum to attach panel, X axis locating part goes down.

4. Put PCB onto fixture, press vacuum button to attach it, panel platform down to bonding position.

5. Adjust PCB fixture manually to align with panel.

6. Press double start button, platform moves to bonding position, pressure head goes down to bond.

7. Bonding finished, platform moves to next bonding position (can set multi-station bonding), platform moves to discharge area.

 

Parameters:

ݔԴUAC380V 50-60HZ

Input power: AC380V 50-60HZ

~ʩU7KW

Rated power: 7KW

≺U0.4-0.7Mpa

Working pressure: 0.4-0.7 Mpa

^ߴUL230mmW2.0mmɶƣ

Size of Pressure Head: L230mmW2.0mm (can be customized)

ӟ᷽ʽUa

Method of heating: Constant temperature

λʽUCCD λ

Method of Alignment: CCD top and bottom alignment

^CU늙C+

Group of Pressure Head: Motor + Cylinder

LCDd̨UX-Y-Z 3S늙C

LCD Platform: X-Y-Z motor driving

ϵyUձPLC+ pro˙C

Controlling System:  Panasonic PLC+ pro touch screen

ͳߴUL1500*W1200*H2200MM󾯟

Dimension: L1500*W1200*H2200MM (include alarm lamp)

̎Uձ

Vacuum Processing: Vacuum Pump

OU850KGԌʣ

Weight of Machine: 850KG (prevail in kind)

 

Features:

1 ӰϵyU2MCCDόλʮ־@ʾʌλҲɸˇCCDC

2 ɶΪضϵyUȱС؅^ơͨӍ_ضȾ

3 LEDԴUͬSR^ԴɸaƷˇ{ɝMOGSFILM-TPGLASS-TPҺӼȲͬ͵Čλ

4 XS׶λUMϷʽچͬX-Y-ZӵĶλbãݵرCaƷλþ

5 X-Y- ^{CU{㣬^ˮƽȸߣԄӾƤ݆ɿԄӾӟቺƤlʼLȾO

6 X-Y-Z SCUd̨X-Y-ZŷƣMOGSFILM-TPGLASS-TPҺӼȲͬ͵ĮaƷFOGFOBOLBPWBȶλðˇе

7 ȫűobéUñC˲ˆTʧ`ˆT

8 FPC ƽ̨ X-Y- {CUX-Y- ǧֳ{A߽M_ٶλЧ

9 obéUɽo늌aƷͬrµĜضȲ͌λӰ

10  PCBCOFмܩUڶΰУڶήaƷXSƄ^е´µIJ

11 CCDλCUǧֳX-Y-Z{{ݣ_

 

1. 2 CCD top alignment and special display guarantee aligning accuracy, CCD top or bottom alignment can be customized.

2. Multi-section temperature controlling guarantees the temperature accuracy.

3. Camera light source can be adjusted as needed, suitable for imaging OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL.

4. Left side loading and discharging is easy to operate by one operator, and X-Y-Z locating parts guarantee locating accuracy of products.

5. Adjusting group of pressure head is easy to operate, Collector of silicone rubber can roll automatically, rolling frequency and length can be set.

6. Servo controlling of platform is suitable for multi station bonding of OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL in FOG, FOB, OLB, PWB process.

7. With the design of grating protection, the machine can avoid injuries caused by operational errors.

8. Fixture is adjusted by micrometer adjuster and with vacuum attaching function that can position fast.

9. Anti-static device can deduce impact from static to products, and also can avoid temperature difference and aligning accuracy caused by airflow.

10. PCB, COF bracket are used in multi section, it can avoid defective caused by hang down during moving in X multi station bonding.

11. CCD aligning group adopt micrometer adjuster which is convenient to focus and with high accuracy.

 

Process:

FOGOLB  FOG, OLB Bonding

FOBPWB  FOB, PWB Bonding

 

Accessories:

Љ  Sensitive Paper

ACF    ACF

  Silicone Rubber

ACFȥҺ   ACF Remover

om  Dust-free Cloth

ƾ  Ethanol

ް  Cotton Swab